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Showing results 1 to 13 of 13
TitleTypeIssue Date
A new method for the lifetime determination of submicron metal interconnects by means of a parallel test structure
2004 24TH INTERNATIONAL CONFERENCE ON MICROELECTRONICS, PROCEEDINGS, VOLS 1 AND 2. p. 633-636.
Proceedings Paper2004
A new method for the lifetime determination of submicron metal interconnects by means of a parallel test structure
Microelectronics Reliability, 45(3-4). p. 753-759
Journal Contribution2005
Copper deposition and subsequent grain structure evolution in narrow lines
THERMEC'2003, PTS 1-5. p. 2485-2490.
Proceedings Paper2003
Electrical performance, reliability and microstructure of sub-45 nm copper damascene lines fabricated with TEOS backfill
MICROELECTRONIC ENGINEERING, 84(11). p. 2681-2685
Journal Contribution2007
High sputter bias super secondary grain growth initiation (In structures)
Russell, SW & Mills, ME & Osaki, A & Yoda, T (Ed.) ADVANCED METALLIZATION CONFERENCE 2006 (AMC 2006). p. 97-103.
Proceedings Paper2007
Increasing the mean grain size in copper films and features
JOURNAL OF MATERIALS RESEARCH, 23(3). p. 642-662
Journal Contribution2008
Increasing the mean grain size in copper films and features
Theses and Dissertations2007
Influence of grain orientation on the microstructural characterization in cu during (self)-anneal using a surface acoustic wave technique
Tsui, TY & Joo, YC & Michaelson, L & Lane, M & Volinsky, AA (Ed.) MATERIALS, TECHNOLOGY AND RELIABILITY OF LOW-K DIELECTRICS AND COPPER INTERCONNECTS. p. 129-134.
Proceedings Paper2006
Microstructural evolution of cu interconnect under AC, pulsed DC and DC current stress
Russell, SW & Mills, ME & Osaki, A & Yoda, T (Ed.) ADVANCED METALLIZATION CONFERENCE 2006 (AMC 2006). p. 453-458.
Proceedings Paper2007
MTF test system with AC based dynamic joule correction for electromigration tests on interconnects
MICROELECTRONICS RELIABILITY, 44(9-11). p. 1849-1854
Journal Contribution2004
Stress in Next Generation Interconnects
Zschech, E. & Maex, K. & Ho, P.S. & Kawasaki, H. & Nakamura, T. (Ed.) 8th International Workshop on Stress-Induced Phenomena in Metallization. p. 157-163.
Proceedings Paper2006
Super secondary grain growth initiation in electroplated copper
Brongersma, SH Taylor, TC Tsujimura, M Masu, K (Ed.) ADVANCED METALLIZATION CONFERENCE 2005 (AMC 2005). p. 615-621.
Proceedings Paper2006
Super secondary grain growth in the barrier/seedlayer system
Proceedings of the Advanced Metallization Conference 2004, San Diego, Calif., USA, October 19-21. p. 327-331.
Proceedings Paper2004
Showing results 1 to 13 of 13